Frame FOUP Adapter / Tape Frame FOUP 200mm

Frame FOUP applied in semi-conductor assembling process, it's used to load and fix metal frame with wafer. Anti-static material, lightweight, airtight design are to isolate and protect wafer, which is used to transfer, store and protect assembling wafer for each process.

● Airtight, Anti-static, Light weighted.
● Original equipment applicable, and AMHS applicable. E-rack automated storage.
● Top Flange high-strength materials, and anti-shock and wear resistance.
● Handle 8-inch wafer on 12-inch process equipment .

● Patent No.:
Taiwanese Patent No.：M489156、M508114、M566707、M566903、M566905、M644369、M607955
Chinese Patent No.：CN208400826U、CN208368484U、CN208538811U、CN208589423U、CN202323288643.4
USA Patent No. US10847394B2