Film Frame FOUP (Dicing) / Tape Frame FOUP Plus in semi-conductor assembling process, it's used to load and fix metal frame with wafer. Anti-static material, lightweight, airtight design are to isolate and protect wafer, which is used to transfer, store and protect assembling wafer for each process.
● Airtight, Anti-static, Light weighted.
● Original equipment applicable, and AMHS applicable. E-rack automated storage.
● Top Flange high-strength materials, and anti-shock and wear resistance.
| Product name |
Wafer size |
Part number |
Capacity |
| Frame FOUP |
12" |
CKF300 |
13 pcs |
| Frame FOUP Plus |
12" |
CKF300 Plus |
13 pcs |
| Frame FOUP ADV |
12" |
CKF300 ADV |
13 pcs |
| Frame FOUP Adapter |
8" |
CKF200 |
13 pcs |
● Patent No.:
Taiwanese Patent No.：M489156、M508114、M566707、M566903、M566905、M644369、M607955
Chinese Patent No.：CN208400826U、CN208368484U、CN208538811U、CN208589423U、CN202323288643.4
USA Patent No. US10847394B2
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