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| Film Frame FOUP (Dicing) / Tape Frame FOUP Plus

 
Film Frame FOUP (Dicing)/Frame FOUP Plus / Tape Frame FOUP Plus
Products Specification
● Product name:Frame FOUP Plus
● Part number:CKF300 Plus
● Dimension:387.0(L) x 392.0(W) x 196(H)mm
● Capacity:13 PCS
● Apply for round wafer:12 inch (Ø300mm) Wafer
● Material:PC ESD
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Products Description

Film Frame FOUP (Dicing) / Tape Frame FOUP Plus in semi-conductor assembling process, it's used to load and fix metal frame with wafer. Anti-static material, lightweight, airtight design are to isolate and protect wafer, which is used to transfer, store and protect assembling wafer for each process.

● Airtight, Anti-static, Light weighted.
● Original equipment applicable, and AMHS applicable. E-rack automated storage.
● Top Flange high-strength materials, and anti-shock and wear resistance.

Product name Wafer size Part number Capacity
Frame FOUP 12" CKF300 13 pcs
Frame FOUP Plus 12" CKF300 Plus 13 pcs
Frame FOUP ADV 12" CKF300 ADV 13 pcs
Frame FOUP Adapter 8" CKF200 13 pcs

Film Frame FOUP (Dicing)/Frame FOUP Adapter / Tape Frame FOUP 200mm

● Patent No.:
Taiwanese Patent No.:M489156、M508114、M566707、M566903、M566905、M644369、M607955
Chinese Patent No.:CN208400826U、CN208368484U、CN208538811U、CN208589423U、CN202323288643.4
USA Patent No. US10847394B2

Customized
● Able to do laser engraving. Able to install RFID. Keep the track of carrier and material
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