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FOUP/FOSB/Wafer SMIF Pod/Front Opening Unified Pod

Opto-Semiconductor-Semiconductor Wafer Carrier
● FOUP / FOSB / SMIF Pod
● Teflon / PFA Cassette
● PP / PEI / PC Cassette
● Metal / PEEK Cassette
● Shipping Box / Single Tray /
Storage Box
● Other

Semiconductor Wafer Carrier / Wafer Size
● 150mm
● 200mm
● 300mm

Stainless Steel Custom
● Metal Frame /Wafer Frame / Wafer Ring

IC Packaging & Testing
● IC Tray / LED Tray / Frame / Frame Cassette / Frame Box

Reticle Handling
● Mask Package Box / RSP 150 /
Mask SMIF Pod

Square Glass Carrier
● Square Glass
● Panel FOUP / FoPLP FOUP

Solar Wafer Carrier
● Solar Cassette/Clean Cassette

Normal & Panel Cassette
● Normal Cassette & Semiautomatic Car

Opto-Semiconductor Equipment
● Test fixture

Plastic-Steel Manufacture
● Mold Injection OEM
● Board/Bar Process

Clean Room
● Cleaning Service
● Automated Cleaning Machine

Contact us
● Headquarters-Taiwan
Contact：Mrs. Li
TEL : +886-3-318-5300#202
FAX : +886-3-328-2290
E-Mail : sales@ckplas.com

● Locatings-China
Contact：Mrs. Li
TEL：+86-512-83667689/90
FAX：+86-512-83667691
E-Mail : sales@ckplas.com.cn

Transparent FOUP 25slot (300mm / 12 inch)

● Product name：Transparent FOUP

● Part number：H300-S1T

● Dimension：440(L) x 347(W) x 337(H)mm

● Weight：5000g

● Capacity：25 PCS

● Apply for round wafer：300mm(12 inch)Wafer

● Material：Customized

● Slot pitch：10 mm

Transparent FOUP / PC FOUP, Able to protect, deliver and store 300mm wafer, provide safe protection during delivery and storage. Reduce particle contamination of wafer, protect wafer from static electricity damage and then increase yield rate.

Transparent FOUP / PC FOUP Features

Transparent FOUP / PC FOUP series of product line fully align with SEMI standard of automation interface, compatible with AMHS. Not only design for standard silicon wafer, but also for special thin wafer application, Transparent FOUP / PC FOUP create mini-environment to protect valuable wafer for transfer and storage purpose.

Transparent FOUP / PC FOUP - front

Transparent FOUP / PC FOUP - back


FOUP CKH313 13 slot	FOUP CKH313 13 slot Back Support	FOUP CKH300 25 slot

Ckplas could customize the product depends on customer’s requirements on different manufacturing process.
Wafer Type	Standard Version Wafer		Thin Wafer
Process Type	General Process	Low Moisture Absorption Material	General Process
Model	H300-S1	H300-L1	H313-S1	H313-S2
Capacity	25 slot	25 slot	13 slot	13 slot
Weight			5.6kg	6.2kg
Main Material	PC ESD	CBM ESD	PC ESD	PC ESD
Rear Window	See Through Window	Black Window	See Through Window	Black Window With Back Support
Temperature Tolerance	≦ 80°C		≦ 80°C
Inflatable Raft Distance	160x250mm		160x250mm
RUN CARD	v	v	v	v
RFID	v	v	v	v

Wafer Type	Thin Wafer
Process Type	General Process	Low Moisture Absorption Material		High Temperature Process
Model	H313-S3	H313-L1	H313-L2	CK313HT
Capacity	13 slot	13 slot	13 slot	13 slot
Weight	6kg	5kg	6kg	6.6kg
Main Material	PC ESD	CBM ESD	CBM ESD	PEI ESD
Rear Window	See Through Window With Back Support	Black Window	Black Window With Back Support	ESD Removable Airtight Black Window
Temperature Tolerance	≦ 60°C	≦ 80°C	≦ 80°C	≦ 150°C
Inflatable Raft Distance	160x250mm			160x260mm
RUN CARD	v	v	v	x
RFID	v	v	v	x


Heat resistant FOUP & ESD Removable Airtight Black Window

Patent No.:
Taiwanese Patent No.：I586597、M563421、M588109、M628876、M625383、M654854
Chinese Patent No.：CN204348693U、CN205609490U、 CN206259327U、CN208007736U、CN210654281U 、CN210654281U
Korea Patent No.：20-0486265

● Able to install RFID & Run Card

● Black Window With Back Support

FOUP Door key

12" 13 slot FOUP

12" 13 slot FOUP (Back Support)

8" Wafer SMIF Pod