Panel Level Packaging Panel FOUP / Panel FOUP

Panel Level Packaging Panel FOUP / Panel FOUP GL-PF508 can carry square glass , Glass Panel and PCB carrier board. Panel FOUP for FoPLP (Fan-out Panel Level Process) is used in panel- level fan-out packaging . Panel FOUP carries large-area and ultra-thin carriers. The large-size, multi-layer one-piece customized design significantly reduces process costs. Panel FOUP supports automated transmission (AMHS), import, mechanical opening, assisting the customized needs of emerging technologies and special processes, providing the best automation assistance for heterogeneous integration.

Panel Level Packaging Panel FOUP / Panel Features

● One-piece molded design, high strength, thin and light, low resonance, achieving superior air-tight effect.
● Simplified parts, reduce parts loosening and avoid accumulation of dirt, ensure safe and reliable automatic operation.
● Antistatic, low dust generation and wear-resistant. Support is manufactured using a special CFRP construction method and has high load-bearing rigidity.
● Comply with SEMI standard (E181, E181.1~E181.4)
● Patent No.:
Taiwanese Patent No.：M552477、M552478、 M588105、M588108、M588355
Chinese Patent No.：CN210556833U